X-eye SF160 Series
Detail View →
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X-ray Tube |
160 kV / 500 µA (option 130 KV / 300 µA) |
|
Min. Resolution |
0.8 ~ 15 µm |
|
Table Size |
Min : 50 x 50 (mm), Max : 330 x 250 (mm) |
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Detector |
1.6 M Pixel FPD |
|
Defects |
BGA : Short, Bridging, Void Chip : Manhattan, Miss align, Short Wire Bonding : Sweep, Broken, Double Bonding, Missing |
|
Objects |
BGA, Chip, QFN, QFP, Wire Bonding |
| Dimension | 1,000(W) x 1,360(D) x 1,450(H)mm / 2,000kg |
In-Line X-ray Inspection System
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.
Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.
Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
- High speed 2D In Line inspection System (0.5 sec/FOV)
- Hybrid Tube with long life span for In-line purpose (10,000hrs/Filament)
- WAXI : Wire Automatic X-ray Inspection Detection of wire defects possible (Shorts, sweep, mssing, etc)
SMT Chip BGA / 2D Inspection
Wire Bonding / 2D Inspection
Applications
