X-eye SF160 Series
Detail View →
|
X-ray Tube |
160 kV / 500 µA |
|
Min. Resolution |
0.8 ~ 15 µm |
|
Table Size |
Min : 50 x 50 (mm), Max : 330 x 250 (mm) |
|
Detector |
12 inch FPXD |
|
CT Scan Method |
Oblique CT |
|
Objects |
BGA, Through Hole, BGA, Chip, QFN, QFP |
| Defects | BGA Short, Bridging, Open, De-wet, Void, etc |
| Foot print | 1,360 x 1,880 x 1,700 mm Control Box : 640 x 950 x 1,190 mm |
| Weight | 4,200kg |
X-ray Machine With High-speed In-Line 3D CT Inspection System
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.
Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.
Inspection speed of 4 sec/FOV from loading to automatic Good/NG judgement.
- High speed 3D In Line Inspection System (~4.3 sec/FOV)
- Hybrid Tube with long life span for In-line purpose (10,000hrs/Filament)
- Best Solution for both-side layered PCB
BGA Void / 3D Inspection
Through Hole Filling / 3D Inspection
Applications
